saving our world, 1mw at a time ? www.fairchildsemi.com dual cool ? packaged powertrench ? mosfets fairchild?s offering dual cool ? packaging, our latest innovation, provides both bottom and topside cooling in a pqfn package. not only is the pqfn an industry standard, but it also gives the designer performance ? exibility within its standard pqfn footprint. with enhanced dual path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with dual cool packaging provides even more impressive results. test results show a heat sinked dual cool package allows synchronous buck converters to deliver higher output current, thus increasing power density. with fairchild?s world-class trench silicon technology, dual cool packaging proves to be a clear leader in power density and thermal performance. dual cool package products are green, lead-free, and rohs compliant; and are now available in 3.3mm x 3.3mm and 5mm x 6mm qfn packages. applications ? point-of-load (pol) synchronous buck conversion ? desktop, notebook, and server ? telecommunications, routing, and switching features & bene? ts ? top side cooling ? lower thermal resistance from junction to top ? same land pattern as 5mm x 6mm and 3.3mm x 3.3mm pqfn ? jedec standard ? allows higher current and power dissipation ? highest power density for dc-dc applications ? use with or without a heat sink, reduces the number of quali? ed components in the bom ? multiple suppliers without cross licensing requirements ? high degree of production commonality with standard pqfn packaging dual cool package 3.3mm x 3.3mm standard pqfn 3.3mm x 3.3mm maximum power dissipation capable of >60% better thermal per formance power loss (w) t j max. = 90c, t a =50c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 air flow = 200lfm no air flow 5mm x 6mm 2 package interconnect q ja (c/w) % improvement from wire package pqfn wire 27.1 - pqfn clip 23.8 13.9% dual cool package 17.2 57.5% environment: minimum pad, heat sink, 200lfm forced air to p bottom 3.3mm x 3.3mm & 5mm x 6mm
for data sheets, application notes, samples and more, please visit: www.fairchildsemi.com for a complete listing of sales representatives and sales offices , visit : www.fairchildsemi.com/cf/sales_contacts to receive information on fairchild products , tradeshows , online seminars and other items , register here for updates : www.fairchildsemi.com/my_fairchild trademarks, service marks, and registered trademarks are the property of fairchild semiconductor or their respective owners. for a listing of fairchild semiconductor trademarks and related information, please see: www.fairchildsemi.com/legal lit. no. 100027-001 ? 2010 fairchild semiconductor. all rights reserved. printed with soy-based inks on recycled paper. dual cool package 3.3mm x 3.3mm pqfn 3.3mm x 3.3mm 120.00 100.00 80.00 60.00 40.00 20.00 0.00 15 10 15 20 25 30 35 load (a) 1-phase ccm with heat sink and forced air 200lfm junction t emperature (c) 5mm x 6mm package product number syncfet ? mosfet bv dss (v) vgs (v) r ds(on) max. gate charge (typ) 10v 4.5v q g (4.5) q gd (m) (m) (nc) (nc) fdms2502sdc y 25 20 1.2 1.6 43 8.8 fdms2504sdc y 25 20 1.3 1.8 39 9.7 FDMS2506SDC y 25 20 1.5 2.1 30 7.5 fdms2508sdc y 25 20 2.0 2.9 22 5.5 fdms2510sdc y 25 20 2.9 4.2 15 4 fdms7650dc* ? 30 20 0.99 1.6 63 13 fdms3006sdc* y 30 20 1.7 2.4 30 8.1 fdms3008sdc* y 30 20 2.2 3.2 22 5.5 fdms3016dc* ? 30 20 6.2 9.0 7 2.5 board solderable component area directfet % difference solderable area total component area (max) dual cool package 3.3mm x 3.3mm 4.5mm 2 the new standard 11.56mm 2 competitor 3mm 2 33% less 19.16mm 2 to p dual cool package competitor to p bottom 3.3mm x 3.3mm package product number syncfet ? mosfet bv dss (v) vgs (v) r ds(on) max. gate charge (typ) 10v 4.5v q g (4.5) q gd (m) (m) (nc) (nc) fdmc2512sdc* y 25 20 2.0 2.9 22 5.5 fdmc2514sdc* y 25 20 2.9 4.7 14 3.8 fdmc3011sdc* y 30 20 1.7 2.5 22 5.9 fdmc7660dc ? 30 20 2.2 3.3 24 5.5 fdmc3020dc* ? 30 20 6.2 9.0 7 2.5 * under development
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